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| 1 | +Solderpad Hardware License v2.1 |
| 2 | + |
| 3 | +This license operates as a wraparound license to the Apache License |
| 4 | +Version 2.0 (the “Apache License”) and incorporates the terms and |
| 5 | +conditions of the Apache License (which can be found here: |
| 6 | +http://apache.org/licenses/LICENSE-2.0), with the following additions and |
| 7 | +modifications. It must be read in conjunction with the Apache License. |
| 8 | +Section 1 below modifies definitions and terminology in the Apache |
| 9 | +License and Section 2 below replaces Section 2 of the Apache License. |
| 10 | +The Appendix replaces the Appendix in the Apache License. You may, at |
| 11 | +your option, choose to treat any Work released under this license as |
| 12 | +released under the Apache License (thus ignoring all sections written |
| 13 | +below entirely). |
| 14 | + |
| 15 | +1. Terminology in the Apache License is supplemented or modified as |
| 16 | +follows: |
| 17 | + |
| 18 | +“Authorship”: any reference to ‘authorship’ shall be taken to read |
| 19 | +“authorship or design”. |
| 20 | + |
| 21 | +“Copyright owner”: any reference to ‘copyright owner’ shall be taken to |
| 22 | +read “Rights owner”. |
| 23 | + |
| 24 | +“Copyright statement”: the reference to ‘copyright statement’ shall be |
| 25 | +taken to read ‘copyright or other statement pertaining to Rights’. |
| 26 | + |
| 27 | +The following new definition shall be added to the Definitions section of |
| 28 | +the Apache License: |
| 29 | + |
| 30 | +“Rights” means copyright and any similar right including design right |
| 31 | +(whether registered or unregistered), rights in semiconductor |
| 32 | +topographies (mask works) and database rights (but excluding Patents and |
| 33 | +Trademarks). |
| 34 | + |
| 35 | +The following definitions shall replace the corresponding definitions in |
| 36 | +the Apache License: |
| 37 | + |
| 38 | +“License” shall mean this Solderpad Hardware License version 2.1, being |
| 39 | +the terms and conditions for use, manufacture, instantiation, adaptation, |
| 40 | +reproduction, and distribution as defined by Sections 1 through 9 of this |
| 41 | +document. |
| 42 | + |
| 43 | +“Licensor” shall mean the owner of the Rights or entity authorized by the |
| 44 | +owner of the Rights that is granting the License. |
| 45 | + |
| 46 | +“Derivative Works” shall mean any work, whether in Source or Object form, |
| 47 | +that is based on (or derived from) the Work and for which the editorial |
| 48 | +revisions, annotations, elaborations, or other modifications represent, |
| 49 | +as a whole, an original work of authorship or design. For the purposes of |
| 50 | +this License, Derivative Works shall not include works that remain |
| 51 | +reversibly separable from, or merely link (or bind by name) or physically |
| 52 | +connect to or interoperate with the Work and Derivative Works thereof. |
| 53 | + |
| 54 | +“Object” form shall mean any form resulting from mechanical |
| 55 | +transformation or translation of a Source form or the application of a |
| 56 | +Source form to physical material, including but not limited to compiled |
| 57 | +object code, generated documentation, the instantiation of a hardware |
| 58 | +design or physical object or material and conversions to other media |
| 59 | +types, including intermediate forms such as bytecodes, FPGA bitstreams, |
| 60 | +moulds, artwork and semiconductor topographies (mask works). |
| 61 | + |
| 62 | +“Source” form shall mean the preferred form for making modifications, |
| 63 | +including but not limited to source code, net lists, board layouts, CAD |
| 64 | +files, documentation source, and configuration files. |
| 65 | + |
| 66 | +“Work” shall mean the work of authorship or design, whether in Source or |
| 67 | +Object form, made available under the License, as indicated by a notice |
| 68 | +relating to Rights that is included in or attached to the work (an |
| 69 | +example is provided in the Appendix below). |
| 70 | + |
| 71 | +2. Grant of License. Subject to the terms and conditions of this License, |
| 72 | +each Contributor hereby grants to You a perpetual, worldwide, |
| 73 | +non-exclusive, no-charge, royalty-free, irrevocable license under the |
| 74 | +Rights to reproduce, prepare Derivative Works of, make, adapt, repair, |
| 75 | +publicly display, publicly perform, sublicense, and distribute the Work |
| 76 | +and such Derivative Works in Source or Object form and do anything in |
| 77 | +relation to the Work as if the Rights did not exist. |
| 78 | + |
| 79 | +APPENDIX |
| 80 | + |
| 81 | +Copyright 2023 CEA* |
| 82 | +*Commissariat a l'Energie Atomique et aux Energies Alternatives (CEA) |
| 83 | + |
| 84 | +SPDX-License-Identifier: Apache-2.0 WITH SHL-2.1 |
| 85 | + |
| 86 | +Licensed under the Solderpad Hardware License v 2.1 (the “License”); you |
| 87 | +may not use this file except in compliance with the License, or, at your |
| 88 | +option, the Apache License version 2.0. You may obtain a copy of the |
| 89 | +License at |
| 90 | + |
| 91 | +https://solderpad.org/licenses/SHL-2.1/ |
| 92 | + |
| 93 | +Unless required by applicable law or agreed to in writing, any work |
| 94 | +distributed under the License is distributed on an “AS IS” BASIS, WITHOUT |
| 95 | +WARRANTIES OR CONDITIONS OF ANY KIND, either express or implied. See the |
| 96 | +License for the specific language governing permissions and limitations |
| 97 | +under the License. |
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